Reliability of thermal interface materials: A review

Thermal interface materials (TIMs) are used extensively to improve thermal conduction across two mating parts. They are particularly crucial in electronics thermal management since excessive junction-to-ambient thermal resistances can cause elevated temperatures which can negatively influence device performance and reliability. Of particular interest to electronic package designers is the thermal resistance of the TIM layer at the end of its design life. Estimations of this allow the package to be designed to perform adequately over its entire useful life. To this end, TIM reliability studies have been performed using accelerated stress tests. This paper reviews the body of work which has been performed on TIM reliability. It focuses on the various test methodologies with commentary on the results which have been obtained for the different TIM materials. Based on the information available in the open literature, a test procedure is proposed for TIM selection based on beginning and end of life performance.