Low Temperature Bonding of Cu Metal through Sintering of Ag Nanoparticles for High Temperature Electronic Application Journal Articles uri icon

  •  
  • Overview
  •  
  • Research
  •  
  • Identity
  •  
  • Additional Document Info
  •  
  • View All
  •  

authors

  • Zhou, Norman
  • Zou, Guisheng
  • Yan, Jianfeng
  • Mu, Fengwen
  • Wu, Aiping
  • Ren, Jialie
  • Hu, Anming

publication date

  • January 1, 2010