Integrated topology and packaging optimization using coupled material and component pseudo-densities

This paper reviews a novel method for integrated topology and packaging optimization in lightweight systems design. Presented as the component-existence model, this approach introduces a new class of packaging design variable coupled with traditional material pseudo-densities in a standard topology workflow. This method adopts a modified interpolation scheme compatible with standard finite element mesh discretizations, and through development of so-called design fields and variable mapping functions, applies gradient-based optimization and analytical sensitivity expressions for driving design updates. The resulting framework can consider multiple overlapping components, enhances effective component mobility in the design domain, and features numerical efficiency comparable to standard topology-only problems. This method is demonstrated in six numerical case studies and compared against solutions from full factorial analysis, with resulting integrated designs approaching or exceeding benchmark configurations within ±5%.