Effect of Diamond Particle Size on the Thermal Properties of Diamond/Al Composites for Packaging Substrate
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Overview
status
publication date
has subject area
published in
Research
keywords
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AL/DIAMOND COMPOSITES
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ALUMINUM
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COATED DIAMOND
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CONDUCTIVITY
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ELASTIC PROPERTIES
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EXPANSION
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FABRICATION
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METAL-MATRIX
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MICROSTRUCTURE
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Metallurgy & Metallurgical Engineering
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OPTIMIZATION
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Science & Technology
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Technology
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diamond particle size
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diamond/Al composite
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electronic packaging
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liquid-solid separation technology
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thermal conductivity
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