Journal article
Current and Potential Applications of Additive Manufacturing for Power Electronics
Abstract
To meet the upcoming challenges of higher power density and higher efficiency for power electronics, a system level approach to the design of power electronic devices must be carried out. Higher system integration and packaging will allow for more compact designs but will also result in challenges for component manufacturing and thermal management. Additive manufacturing can potentially mitigate some of these challenges due to the design …
Authors
Lopera L; Rodriguez R; Yakout M; Elbestawi M; Emadi A
Journal
IEEE Open Journal of Power Electronics, Vol. 2, , pp. 33–42
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
DOI
10.1109/ojpel.2021.3052541
ISSN
2644-1314