Home
Scholarly Works
Nitrogen Implantation in SiC: Lattice Disorder and...
Chapter

Nitrogen Implantation in SiC: Lattice Disorder and Foreign-Atom Location Studies

Abstract

The implantation behaviour of 25–80 keV nitrogen in α-SiC has been investigated for doses of 2 × 1015and 2 × 1016 N atoms/ cm2 as a function of implantation temperature (20–450°C) and subsequent anneal treatments up to 1485°C. Backscattering yield measurements (using a 2 MeV helium beam) and 15N(p, a) nuclear reaction yield measurements (using a 1 MeV proton beam) have been used to study the amount of residual damage in the crystal and the lattice location of the implanted nitrogen atoms, respectively. The results clearly indicate the advantage of high temperature implantation in producing a high “substitutional” fraction (~ 70%) and a minimum damage level. In the 450° C implants, a maximum substitutional nitrogen concentration of ~ 1 × 1021/cm3 was obtained. Evidence for an anomalous “inverse annealing” stage at ~ 800°C is observed for the 350 and 450° C implants, with the residual damage level increasing markedly and the “substitutional” nitrogen fraction decreasing to around the 50% level.

Authors

Campbell AB; Shewchun J; Thompson DA; Davies JA; Mitchell JB

Book title

Ion Implantation in Semiconductors

Pagination

pp. 291-298

Publisher

Springer Nature

Publication Date

January 1, 1975

DOI

10.1007/978-1-4684-2151-4_37
View published work (Non-McMaster Users)

Contact the Experts team