Journal article
Automotive Power Module Packaging: Current Status and Future Trends
Abstract
Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design …
Authors
Yang Y; Dorn-Gomba L; Rodriguez R; Mak C; Emadi A
Journal
IEEE Access, Vol. 8, , pp. 160126–160144
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Publication Date
January 1, 2020
DOI
10.1109/access.2020.3019775
ISSN
2169-3536