Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature

Copper wire is attracting more and more attention in wire bonding technology due to its advantages in comparison with gold or aluminum wire. This paper presents an achievement of ultrasonic wedge bonding with 25μm copper wire on Au/Ni plated Cu substrate at ambient temperature. A detailed investigation from the aspects of process optimization, bonding mechanism, interdiffusion, ultrasonic effects on microstructure and microhardness of the …