Journal article
Ultrasonic friction power during Al wire wedge-wedge bonding
Abstract
Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25μm diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding. Auxiliary measurements include the current delivered to the ultrasonic transducer, the vibration amplitude of the …
Authors
Shah A; Gaul H; Schneider-Ramelow M; Reichl H; Mayer M; Zhou Y
Journal
Journal of Applied Physics, Vol. 106, No. 1,
Publisher
AIP Publishing
Publication Date
July 1, 2009
DOI
10.1063/1.3158065
ISSN
0021-8979