Journal article
Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding
Abstract
Authors
Pequegnat A; Hang CJ; Mayer M; Zhou Y; Moon JT; Persic J
Journal
Journal of Materials Science: Materials in Electronics, Vol. 20, No. 11, pp. 1144–1149
Publisher
Springer Nature
Publication Date
January 23, 2009
DOI
10.1007/s10854-008-9841-8
ISSN
0957-4522