Substrate stresses for double load copper wire bonding Journal Articles

authors

• Huang, H
• Chang, B
• Du, D
• Zhou, Norman

status

• published 

publication date

• July 1, 2010

has subject area

• 0912 Materials Engineering (FoR)
• 0913 Mechanical Engineering (FoR)
• General Science & Technology (Science Metrix)

published in

• Tsinghua Science and Technology  Journal

start page

• 970

end page

• 973

volume

• 50

issue

• 7