Low temperature sintering-bonding using mixed Cu+Ag nanoparticle paste for packaging application Journal Articles uri icon

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authors

  • Zhang, Y
  • Yan, J
  • Zou, G
  • Bai, H
  • Liu, L
  • Wu, A
  • Yan, J
  • Zhou, Norman

publication date

  • August 1, 2013

has subject area