Quantitative evaluation of high temperature deformation mechanisms: a specific microgrid extensometry technique coupled with EBSD analysis

A microgrid extensometry method has been developed and used to obtain information about intragranular and intergranular creep mechanisms. An oxide grid was deposited on a creep specimen using an electron lithography technique. This oxide grid offers high backscattered electron contrast and can withstand long duration creep tests under vacuum in the 700–850 °C range without degradation. Specific methods were used to measure in-plane …