A novel on chip test method to characterize the creep behavior of metallic layers under heavy ion irradiation

An on chip test method has been developed to characterize the irradiation creep behavior of thin freestanding films under uniaxial tension. The method is based on the use of a long beam involving large internal stress protected from the irradiation flux that imposes a spring like deformation to a specimen beam. These elementary freestanding structures fabricated using a combination of deposition, lithography and release steps are multiplied …