Creep behavior of submicron copper films under irradiation

The creep behavior under heavy ion irradiation of 200 nm and 500 nm thick annealed Cu films is characterized using on chip uniaxial microtensile test structures. The tests are performed at room temperature with an applied stress between 100 and 250 MPa and a damage rate of 5 × 10−4 and 6.3 × 10−4 dpa s−1. The deformation rates produced under irradiation are several orders of magnitude larger than when measured out of flux. The main advantage of …