Journal article
Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
Abstract
Bumping of microcircuits and substrates establishes interconnect points required for subsequent bonding of microelectronic components, allowing for power and data distribution. Simultaneous ultrasonic bonding of individual Au balls promises to accelerate bumping processes and is studied using a finite element model. The model covers the static forces at the end of a successful bonding operation and analyzes the interfacial stresses between …
Authors
Song WH; Karimi A; Huang Y; Mayer M; Zhou N; Jung JP
Journal
Journal of Electronic Packaging, Vol. 131, No. 4,
Publisher
ASME International
Publication Date
December 1, 2009
DOI
10.1115/1.4000281
ISSN
1043-7398