Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor
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Overview
status
publication date
- December 2008
has subject area
- 0906 Electrical and Electronic Engineering (FoR)
- 0912 Materials Engineering (FoR)
- 0913 Mechanical Engineering (FoR)
- Nanoscience & Nanotechnology (Science Metrix)