Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor

Two real-time, in situ methods to measure the breaking force of fine bonding wires while on the wire bonder are reported and compared. The first method uses a special test chip with a piezoresistive microsensor integrated next to the bonding pad. A 25μm diameter Au wire piece is attached with a ball bond to the test pad of the microsensor. The wire piece between the ball bond and the lower edge of the wire clamps is 15mm in length. The clamps …