Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications

Abstract During the last two decades, considerable efforts have been made to explore new generations of interconnecting materials and printed lines to replace the traditionally used toxic lead-based solders in electronic packaging industries. Accordingly, development of electrically conductive adhesives (ECAs) with high electrical conductivity has become an interesting and urgent research venue in this field. Recently, the incorporation of …