Reinforcement of Ag nanoparticle paste with nanowires for low temperature pressureless bonding

Low temperature interconnection processes for lead-free packaging and flexible electronics are currently of great interest. Several studies have focused on bonding using silver nanoparticles (Ag NPs) or copper nanoparticles (Cu NPs). However, pressure assistance is generally necessary for bonding with nanomaterial pastes, which limits its industrial applications. Here, a unique method for bonding of copper wires using Ag NP and nanowire binary …