Electrical Conductive Adhesives Enhanced with High‐Aspect‐Ratio Silver Nanobelts

The utilization of high‐aspect‐ratio silver nanobelts (NBs) is reported with the typical silver micro flakes to develop advanced electrical conductive adhesive (ECA) composite materials. Ag NBs (10–40 nm thick, 100–400 nm wide and 1–10 µm long) were synthesized by chemical reduction of silver nitride. The incorporation of a small amount of the Ag NBs (NBs to flakes weight‐ratio K = 0.03) into a conventional ECA with 60 wt% Ag micro flakes results in an electrical conductivity enhancement by 1300%. It is also found that adding a 2 wt% ( K = 0.03) of the NBs into a conventional ECA with 80 wt% Ag flakes reduced the bulk resistivity to 3 × 10 −5 Ω · cm for the hybrid ECAs, which is comparable to that of a typical eutectic solder, showing great potential as an alternative electrical interconnect materials.