Journal article
Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering
Abstract
A new mixed nano paste consisting of silver nanoparticles, silver nanowires and copper nanoparticles has been proposed as the active material in an alternative joining approach for interconnection in electronic packaging. The mixed nano paste was optimized by adding different contents of copper nanoparticles into silver nanoparticle and nanowire pastes. Compared with the common silver nanoparticle paste, the electrochemical migration time of …
Authors
Guo W; Zhang H; Zhang X; Liu L; Peng P; Zou G; Zhou YN
Journal
Journal of Alloys and Compounds, Vol. 690, , pp. 86–94
Publisher
Elsevier
Publication Date
January 2017
DOI
10.1016/j.jallcom.2016.08.060
ISSN
0925-8388