Preparation of PVP coated Cu NPs and the application for low-temperature bonding

There is an increasing interest in developing a low temperature interconnection process using nanoparticles. Some studies focus on bonding using Ag nanoparticles (Ag NPs). However, few studies investigate a bonding process using Cu nanoparticles (Cu NPs) due to the easy oxidation in air. Here we achieve a robust bonding of Cu wires to Cu pads with polyvinylpyrrolidone (PVP) coated Cu NPs at a low temperature of 170 °C. The PVP coating can …