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Scanning capacitance microscopy imaging of silicon...
Journal article

Scanning capacitance microscopy imaging of silicon metal-oxide-semiconductor field effect transistors

Abstract

We have studied cross-sectioned n- and p-metal-oxide-semiconductor field effect transistors with gate lengths approaching 60 nm using a scanning capacitance microscope (SCM). In a homogeneous semiconductor, the SCM measures the depletion length, determining the dopant concentration. When imaging a real device there is an interaction between the probe tip and the built-in depletion of the p-n junction. With the help of a device simulator, we can understand the relation between the SCM images and the position of the p-n junction, making the SCM a quantitative tool for junction delineation and direct measurement of the electrical channel length.

Authors

Kleiman RN; O’Malley ML; Baumann FH; Garno JP; Timp GL

Journal

Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena, Vol. 18, No. 4, pp. 2034–2038

Publisher

American Vacuum Society

Publication Date

July 1, 2000

DOI

10.1116/1.1306331

ISSN

2166-2746
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