Chapter
Transmission lines and passive components
Abstract
The goal of this chapter is to analyze the problems in the modeling and design of passive components at increased frequencies up 100 GHz. It starts with a short review on the state of the silicon technology, employed materials, techniques, and the chip architectures. Transmission lines, integrated components, packaging issues and three-dimensional integration are analyzed and discussed. The chapter also includes EM modeling of modified low-loss …
Authors
Kouzaev GA; Deen MJ; Nikolova NK
Book title
Advances in Imaging and Electron Physics
Volume
174
Pagination
pp. 119-222
Publication Date
January 1, 2012
DOI
10.1016/B978-0-12-394298-2.00002-8