Transmission lines and passive components

The goal of this chapter is to analyze the problems in the modeling and design of passive components at increased frequencies up 100 GHz. It starts with a short review on the state of the silicon technology, employed materials, techniques, and the chip architectures. Transmission lines, integrated components, packaging issues and three-dimensional integration are analyzed and discussed. The chapter also includes EM modeling of modified low-loss interconnects and via-holes for high-speed applications. © 2012 Elsevier Inc.