Processing-induced strains at solder interfaces in extended semiconductor structures

The processing-induced strain in unmetallized areas within solder interfaces of packaged, diode laser chips is investigated by spectroscopic methods, namely, degree of polarization of photoluminescence and photocurrent spectroscopy. An unexpected strain component in the unmetallized regions is identified. Based on spectroscopic results used in concert with modeling that employs the finite element method and theoretical results, this strain …